S7
Recommend for Intel® Sapphire Rapids Processor, Socket FCLGA 4677, Active Cooler for 1U Server and up, Copper Heatsink with Vapor Chamber Base, Support 205 Watts CPU Power Heat Dissipation.
Note:
Dynatron S2, S3, S4, S5, S6, and S7 each comes with E1B Package Carrier.
E1A and E1C Package Carriers are not included but they are available upon request
Additional Information
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CPU Support |
Intel |
CPU Socket |
FCLGA 4677 |
Solution |
1U Server and Up |
Dimensions |
118.6 x 80.5 x 27.4 mm |
Weight |
424.6 g |
Material |
Copper 1100 Heatsink with Vapor Chamber Base |
Fan Dimension |
80 x 13 mm |
Speed |
At Duty Cycle 0~20%: 1900 ± 200 RPM |
Rated Voltage |
12V |
Bearing |
Double Ball |
Power |
At Duty Cycle 20%: 1.08 W |
Air Flow |
At Duty Cycle 20%: 4.0 CFM |
Noise Level |
At Duty Cycle 20%: 23.3 dBA |
Air Pressure |
At Duty Cycle 20%: 3.15 mm-H2O |
Lead Wire Pin Out |
Pin#1-Black(-) |
Thermal Grease |
Shin-Etsu 7762 Pre-printed |
*All product specifications and product images are subject to change without notice.