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S4

S4

Recommend for Intel® Sapphire Rapids Processor, Socket FCLGA 4677, Copper for both Vapor Chamber Base and Fin Stack, Passive Cooler for 1U Server and up, Support 205 Watts CPU Power Heat Dissipation.

 

Note:

Dynatron S2, S3, S4, S5, S6, and S7 each comes with E1B Package Carrier.
E1A and E1C Package Carriers are not included but they are available upon request.

 

CPU Support

Intel® Sapphire Rapids Processor

CPU Socket

Socket FCLGA 4677

Solution

Blade and 1U Server

Dimensions

118 x 78 x 27 mm

Weight

437.60 g

Material

Copper Vapor Chamber and Fin Stack

Thermal Grease

Pre-Printed with SHIN-ETSU 7762

*Allproduct specifications and product images are subject to change withoutnotice.

 

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