Recommend for Intel® 3rd Gen. Xeon Scalable Processor (code name Ice Lake and Copper Lake), FCLGA4189-4/5(Socket P4/P5), Copper for both Vapor Chamber Base and Fin Stack, Passive Cooler for Blade and 1U Server. Support 205 Watts CPU Power Heat Dissipation.
Intel® 3rd Gen. Xeon Scalable Processor (code name Ice Lake and Copper Lake)
FCLGA 4189-4/5(Socket P4/P5)
Blade and 1U Server
113 x 78 x 25 mm
Copper 1100 for both Vapor Chamber Base and Fin Stack
Shin-Etsu 7762 Pre-printed
*All product specifications and product images are subject to change without notice.