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N3

N3

Recommend for Intel® 3rd Gen. Xeon Scalable Processor (code name Ice Lake and Copper Lake), FCLGA4189-4/5(Socket P4/P5), Active Cooler for 1U Server, Copper Heatsink with Vapor Chamber Base, Steel PWM Blower, Support 205 Watts CPU Power Heat Dissipation.
 
* For Intel® 3rd Gen. Xeon Scalable Processor(code name Copper Lake, Socket LGA4189-5), DY-PK-4189-P5 Package Carrier needs to purchase separately.
CPU Support

Intel® 3rd Gen. Xeon Scalable Processor (code name Ice Lake and Copper Lake)
CPU Socket

FCLGA 4189-4/5(Socket P4/P5)
Solution

1U Server and Up
Dimensions

113.0 x 80 x 27 mm
Weight

410 g
Material

Copper1100 Heatsink with Vapor Chamber Base
Fan Dimension

80 x 13 mm
Speed

At Duty Cycle 0~20%: 2000 ± 200 RPM
At Duty Cycle 50%: 4900 ± 10% RPM
At Duty Cycle 100%: 8600 ± 10% RPM
Rated Voltage

12V
Bearing

2 Ball Bearing
Power

At Duty Cycle 20%: 1.08 W
At Duty Cycle 50%: 4.7 W
At Duty Cycle 100%: 23.45 W
Air Flow

At Duty Cycle 20%: 5.59 CFM
At Duty Cycle 50%: 14.76 CFM
At Duty Cycle 100%: 26.25 CFM
Noise Level

At Duty Cycle 20%: 23.3 dBA
At Duty Cycle 50%: 43.5 dBA
At Duty Cycle 100%: 62.2 dBA
Air Pressure

At Duty Cycle 20%: 3.69 mm-H2O
At Duty Cycle 50%: 25.28 mm-H2O
At Duty Cycle 100%: 89.80 mm-H2O
Lead Wire Pin Out

Pin#1-Black(-)
Pin#2- Yellow(+)
Pin#3- Green(Tachometer/ Signal Output)
Pin#4- Blue (PWM)
Thermal Grease

Shin-Etsu 7762 Pre-printed

*All product specifications and product images are subject to change without notice.

 

 

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