N2
Recommend for Intel® 3rd Gen. Xeon Scalable Processor (code name Ice Lake and Copper Lake), FCLGA4189-4/5(Socket P4/P5), Aluminum for both heat sink Base and Fin Stack, Passive Cooler for 2U Server and up, Support 270 Watts CPU Power Heat Dissipation.
* For Intel® 3rd Gen. Xeon Scalable Processor(code name Copper Lake, Socket LGA4189-5), DY-PK-4189-P5 Package Carrier needs to purchase separately.
| CPU Support |
Intel® 3rd Gen. Xeon Scalable Processor (code name Ice Lake and Copper Lake) |
|---|---|
| CPU Socket |
FCLGA 4189-4/5(Socket P4/P5) |
| Solution |
2U Server and up |
| Dimensions |
113 x 78 x 64 mm |
| Weight |
460 g |
| Material |
Aluminum for both heat sink Base and Fin Stack |
| Thermal Grease |
Shin-Etsu 7762 Pre-printed |
*All product specifications and product images are subject to change without notice.