top of page
N11

N11

Recommend for Intel® 3rd Gen. Xeon Scalable Processor (code name Ice Lake and Copper Lake), FCLGA4189-4/5(Socket P4/P5), Aluminum Fin stack with Heat Pipe embedded, Active Cooler for 2U Server and up, Support 270 Watts CPU Power Heat Dissipation.
 
* For Intel® 3rd Gen. Xeon Scalable Processor(code name Copper Lake, Socket LGA4189-5),  DY-PK-4189-P5 Package Carrier needs to purchase separately.
CPU Support

Intel® 3rd Gen. Xeon Scalable Processor (code name Ice Lake and Copper Lake)
CPU Socket

FCLGA 4189-4/5(Socket P4/P5)
Solution

2U Server and Up
Dimensions

113.0 x 82.0 x 66.0 mm
Weight

460 g
Material

Aluminum Fin stack with Heat Pipe embedded
Fan Dimension

60 x 60 x 25 mm
Speed

Up to 8500 RPM
Rated Voltage

12V
Bearing

2 Ball Bearing
Power

At Duty Cycle 0~20%: 1.2 W
At Duty Cycle 50%: 2.52 W
At Duty Cycle 100%: 9.6 W
Air Flow

At Duty Cycle 0~20%: 9.86 CFM
At Duty Cycle 50%: 23.21 CFM
At Duty Cycle 100%: 49.32 CFM
Noise Level At Duty Cycle 0~20%: 19.3 dBA
At Duty Cycle 50%: 37.9 dBA
At Duty Cycle 100%: 54.3 dBA 
Air Pressure

At Duty Cycle 0~20%: 0.86 mm-H2O
At Duty Cycle 50%: 4.76 mm-H2O
At Duty Cycle 100%: 21.5 mm-H2O 
Lead Wire Pin Out

Pin#1-Black(-)
Pin#2- Yellow(+)
Pin#3- Green(Tachometer/ Signal Output)
Pin#4- Blue (PWM)
Thermal Grease

Shin-Etsu 7762 Pre-printed

*All product specifications and product images are subject to change without notice.

 

 

bottom of page