N10
Recommend for Intel® 3rd Gen. Xeon Scalable Processor (code name Ice Lake and Copper Lake), FCLGA4189-4/5(Socket P4/P5), Copper for both Vapor Chamber Base and Fin Stack, Passive Cooler for Blade and 1U Server. Support 205 Watts CPU Power Heat Dissipation.
* For Intel® 3rd Gen. Xeon Scalable Processor(code name Copper Lake, Socket LGA4189-5), DY-PK-4189-P5 Package Carrier needs to purchase separately.
Additional Information
Downloads
Video
| CPU Support |
Intel® Ice Lake and Cooper Lake Server Processor |
|---|---|
| CPU Socket |
FCLGA 4189-4/5(Socket P4/P5 or P+ ) |
| Solution |
Blade and 1U Server |
| Dimensions |
113 x 78 x 27 mm |
| Weight |
450 g |
| Material |
Copper 1100 for both Vapor Chamber Base and Fin Stack |
| Thermal Grease |
Shin-Etsu 7762 Pre-printed |
*All product specifications and product images are subject to change without notice.