K1
Passive Heat Sink
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CPU Support
Intel
Core™ i5 I5-750、Xeon® Processor 3400
Core™ i7 Processors, I7-870 & I7-860
CPU Socket
LGA1156
APPLICATION
1U
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‧ Support CPU power 170 Watts Heat Dissipation.
‧ Aluminum Base and Fin Stack
‧ PWN function
‧ HCC (Heatpipe Contact CPU)
‧ Dimensions/95 x 95 x 130 mm
Additional Information
Downloads
|
CPU Support |
Intel |
|
CPU Socket |
1156, Core i3 530/ 540, Core i5 650/ 660/ 661/ 670/ 750; Xeon Processor 3400 Series; Core i7 870 / 860 |
|
Solution |
1U |
|
Dimensions |
95.0 x 95.0 x 26.5 mm |
|
Weight |
300 g |
|
Material |
Aluminum Skived Fin |
|
Backplate |
Back Strip is Included |
|
Thermal Grease |
Thermal Grease Pre-Printed with GE-Toshiba TIG830SP |
*All product specifications and product images are subject to change without notice.