B8
Aluminum Stacked fin soldered on Copper base with 4x Heat Pipes embedded for 2U server & up solution up to TDP 205 Watts heat dissipation
Additional Information
Downloads
CPU Support |
Intel |
---|---|
CPU Socket |
FCLGA3647 |
Solution |
2U Server and Up |
Dimensions |
108.0 x 80.0 x 64.0 mm |
Weight |
600 g |
Material |
Aluminum Stacked fin soldered on Copper base with 4x Heat Pipes embedded |
Thermal Grease |
Shin-Etsu 7762 Pre-Applied |
*All product specifications and product images are subject to change without notice.