B8

B8

Aluminum Stacked fin soldered on Copper base with 4x Heat Pipes embedded for 2U server & up solution up to TDP 205 Watts heat dissipation

  • Additional Information

    CPU Support

    Intel

    CPU Socket

    FCLGA3647

    Solution

    2U Server and Up

    Dimensions

    108.0 x 80.0 x 64.0 mm

    Weight

    600 g

    Material

    Aluminum Stacked fin soldered on Copper base with 4x Heat Pipes embedded

    Thermal Grease

    Shin-Etsu 7762 Pre-Applied

    *All product specifications and product images are subject to change without notice.

     

     

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