Copper skived fin passive heatsink for 1U server solution up to TDP 205 Watts.
Intel Purley – EP / EX, Socket LGA 3647
1U Server and Up
90 x 90 x 27 mm
Copper1100 Stacked Fin Heatsink with Vapor Chamber Base
Shin-Etsu 7762 Pre-printed
*All product specifications and product images are subject to change without notice.