B6

Copper skived fin passive heatsink for 1U server solution up to TDP 205 Watts.

CPU Support
CPU Socket
APPLICATION
  • Additional Information

    CPU Support

    Intel

    CPU Socket

    Intel Purley – EP / EX, Socket LGA 3647

    Solution

    1U Server and Up

    Dimensions

    90 x 90 x 27 mm

    Weight

    420 g

    Material

    Copper1100 Stacked Fin Heatsink with Vapor Chamber Base

    Thermal Grease

    Shin-Etsu 7762 Pre-printed

    *All product specifications and product images are subject to change without notice.

  • Downloads

政久興業股份有限公司
Dynatron Corporation

台北市內湖區港漧路221巷35號8樓

No. 35, Lane 221, Gangqian Road, Neihu District, Taipei City, Taiwan 114
電話:+886 2 2799 5799

傳真:+886 2 2799 9577

sales@dynatron.tw

FOR SPECIAL REQUESTS & ORDERS

© 2020 by Dynatron Corporation.