B1
Copper skived fin passive heatsink for 1U server solution up to TDP 135 Watts.
Additional Information
CPU Support Intel
CPU Socket Intel Purley – EP / EX, Socket LGA 3647
Solution 1U Server and Up
Dimensions 108.0 x 78.0 x 27.0 mm
Weight 600 g
Material Copper Skived fin
Thermal Grease Shin-Etsu 7762 Pre-Applied
*All product specifications and product images are subject to change without notice.
Downloads