B1

B1

Copper skived fin passive heatsink for 1U server solution up to TDP 135 Watts.

  • Additional Information

    CPU Support

    Intel

    CPU Socket

    Intel Purley – EP / EX, Socket LGA 3647

    Solution

    1U Server and Up

    Dimensions

    108.0 x 78.0 x 27.0 mm

    Weight

    600 g

    Material

    Copper Skived fin

    Thermal Grease

    Shin-Etsu 7762 Pre-Applied

    *All product specifications and product images are subject to change without notice.

     

     

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