N11
Recommend for Intel® 3rd Gen. Xeon Scalable Processor (code name Ice Lake and Copper Lake), FCLGA4189-4/5(Socket P4/P5), Aluminum Fin stack with Heat Pipe embedded, Active Cooler for 2U Server and up, Support 270 Watts CPU Power Heat Dissipation.
* For Intel® 3rd Gen. Xeon Scalable Processor(code name Copper Lake, Socket LGA4189-5), DY-PK-4189-P5 Package Carrier needs to purchase separately.
| CPU Support |
Intel® 3rd Gen. Xeon Scalable Processor (code name Ice Lake and Copper Lake) |
|---|---|
| CPU Socket |
FCLGA 4189-4/5(Socket P4/P5) |
| Solution |
2U Server and Up |
| Dimensions |
113.0 x 82.0 x 66.0 mm |
| Weight |
460 g |
| Material |
Aluminum Fin stack with Heat Pipe embedded |
| Fan Dimension |
60 x 60 x 25 mm |
| Speed |
Up to 8500 RPM |
| Rated Voltage |
12V |
| Bearing |
2 Ball Bearing |
| Power |
At Duty Cycle 0~20%: 1.2 W |
| Air Flow |
At Duty Cycle 0~20%: 9.86 CFM |
| Noise Level | At Duty Cycle 0~20%: 19.3 dBA At Duty Cycle 50%: 37.9 dBA At Duty Cycle 100%: 54.3 dBA |
| Air Pressure |
At Duty Cycle 0~20%: 0.86 mm-H2O |
| Lead Wire Pin Out |
Pin#1-Black(-) |
| Thermal Grease |
Shin-Etsu 7762 Pre-printed |
*All product specifications and product images are subject to change without notice.