B1
Copper skived fin passive heatsink for 1U server solution up to TDP 135 Watts.
| CPU Support |
Intel |
|---|---|
| CPU Socket |
Intel Purley – EP / EX, Socket LGA 3647 |
| Solution |
1U Server and Up |
| Dimensions |
108.0 x 78.0 x 27.0 mm |
| Weight |
600 g |
| Material |
Copper Skived fin |
| Thermal Grease |
Shin-Etsu 7762 Pre-Applied |
*All product specifications and product images are subject to change without notice.