H53G

For Intel®Dual-Core Xeon®Dempsey, Woodcrest & Clovertown Socket 771, Copper Heatsink, Passive Cooler for 2U Server and Up

CPU Support
CPU Socket
APPLICATION
  • Additional Information

    CPU Socket

    LGA771

    CPU Support

    Intel

    Solution

    2U Server and Up

    Dimensions

    90.0 x 78.5 x 52.0 mm

    Weight

    910 g

    Material

    Copper Heat Sink

    Thermal Grease

    Pre-Applied Shin-Etsu Thermal Grease

    *All product specifications and product images are subject to change without notice.

  • Downloads

政久興業股份有限公司
Dynatron Corporation

台北市內湖區港漧路221巷35號8樓

No. 35, Lane 221, Gangqian Road, Neihu District, Taipei City, Taiwan 114
電話:+886 2 2799 5799

傳真:+886 2 2799 9577

sales@dynatron.tw

FOR SPECIAL REQUESTS & ORDERS

© 2020 by Dynatron Corporation.